Thermoplastic Polyimide Moulding Powder

Product Name: Thermoplastic Polyimide Moulding Powder Item No.: SolverPI-Powder 1600 Mesh size: ≥200 Mesh SPECIFICATIONS: Properties Testing Method Unit Value Basic performance Appearance / / Light Yellow Linear expansion coefficient of (23-30℃) GB/T 1036-1989 1/℃ 3.68*10-5 Density(25℃) / g/cm3 1.38 Intrinsic viscosity Q/HSMT dL/g 0.5-0.8 Rockwell hardness (m) GB/T 3398.2-2008 / 110 Oxygen index GB/T 2406.2-2009 % 46 The vertical combustion GB/T 2408-2008 level V-0 Mechanical properties of The tensile strength GB/T 1040.2/1A-2006 MPa 108 Elongation at break GB/T 1040.2-2006 % 15 The impact strength (no gap) GB/ 1043.1/1eU-2008 KJ/m2 244 The bending strength GB/T 9341-2008 MPa 135 The compression strength GB/ T 1041-2008 MPa 136 The coefficient of friction GB/T 3960-1983(1989) / 0.43 Thermal performance The thermal deformation temperature(1.80MPa) GB/T 1634.2-2004 ℃ 250 Glass transition temperature (nitrogen atmosphere) GB/T 19466.2-2009 ℃ 260 Electrical properties Dielectric strength GB/T 1408.1-2006 MV/m 16.3 Volume resistivity GB/T1410-2006 Ω•m 2.0*1014 Definition: A high molecular weight, poor mobility, used for molding. Thermoplastic PI is an amorphous resin, the products made from thermoplastic PI is amber and transparent. Main Characteristics:  Creep resistance, radiation resistance, good wave penetrating ability;  Good corrosion resistance, moisture absorption is higher than ordinary plasticslightly;  Not resistant to strong acid, alkali and high temperature steam (The only Shortcomings); In a word, SOLVER Thermoplastic Polyimide Moulding Powder (SolverPI-Powder 1600) can completely replace Mitsui AURUM. Application: Press all kinds of machinery, electronic components, such as floating seal ring, sealing ring, bush pressed sheet, rod, diamond grinding tools etc. The demand of high grade diamond abrasive for thermoplastic PI is big because the traditional adhesives can not meet their requirements. Moulded Samples: